Design and Fabrication of a Wideband 8-Element Series-Feed Array on Metallic-Nanowire-Membrane Interposer for Millimeter Wave Frequency

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Autor(es): dc.contributorUniversidade Estadual Paulista (UNESP)-
Autor(es): dc.contributorTIMA-
Autor(es): dc.contributorUniversidade Federal de Uberlândia (UFU)-
Autor(es): dc.contributorUniversidade de São Paulo (USP)-
Autor(es): dc.creatorDarweesh, Nawar-
Autor(es): dc.creatorBernardo, Helton-
Autor(es): dc.creatorRibeiro, Raul O.-
Autor(es): dc.creatorAldaya, Ivan-
Autor(es): dc.creatorSantos, Renan A.-
Autor(es): dc.creatorDa Rosa, Guilherme S.-
Autor(es): dc.creatorRehder, Gustavo P.-
Autor(es): dc.creatorSerrano, Ariana L. C.-
Autor(es): dc.creatorPenchel, Rafael A.-
Data de aceite: dc.date.accessioned2025-08-21T19:16:20Z-
Data de disponibilização: dc.date.available2025-08-21T19:16:20Z-
Data de envio: dc.date.issued2025-04-29-
Data de envio: dc.date.issued2023-12-31-
Fonte completa do material: dc.identifierhttp://dx.doi.org/10.1109/LACAP63752.2024.10876302-
Fonte completa do material: dc.identifierhttps://hdl.handle.net/11449/306887-
Fonte: dc.identifier.urihttp://educapes.capes.gov.br/handle/11449/306887-
Descrição: dc.descriptionThe purpose of this work is to present an 8-element wideband series-fed array antenna fabricated on a metallic-nanowire-membrane (MnM) interposer for 60 GHz millimeter-wave applications. The MnM interposer, based on nanoporous technology filled with copper, serves as an novel substrate with high potential for 3D integrated circuits due to the ease of creating through-substrate vias (TSV) and interconnections between microwave components and system-on-chip (SoC). The results demonstrate a wideband frequency with adequate impedance matching of 19.48 GHz (simulated) and 23.80 GHz (measured).-
Descrição: dc.descriptionSão Paulo State University (UNESP) School of Engineering, SP-
Descrição: dc.descriptionUniv. Grenoble-Alpes (UGA) CNRS Institut National Polytechnique Grenoble Alpes (Grenoble INP) TIMA-
Descrição: dc.descriptionCampus of Patos de Minas Federal University of Uberlandia (UFU), MG-
Descrição: dc.descriptionSchool of Engineering Univ. of São Paulo (USP), SP-
Descrição: dc.descriptionSão Paulo State University (UNESP) School of Engineering, SP-
Idioma: dc.languageen-
Relação: dc.relationLACAP 2024 - 1st Latin American Conference on Antennas and Propagation, Conference Proceedings-
???dc.source???: dc.sourceScopus-
Palavras-chave: dc.subject3D integration-
Palavras-chave: dc.subjectMillimeter-Wave (mmW)-
Palavras-chave: dc.subjectMnM interposer-
Palavras-chave: dc.subjectseries-fed array antennas-
Título: dc.titleDesign and Fabrication of a Wideband 8-Element Series-Feed Array on Metallic-Nanowire-Membrane Interposer for Millimeter Wave Frequency-
Tipo de arquivo: dc.typeaula digital-
Aparece nas coleções:Repositório Institucional - Unesp

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