Epoxy as an Alternative Resin in Particleboard Production with Pine Wood Residues: Physical, Mechanical, and Microscopical Analyses of Panels at Three Resin Proportions

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Autor(es): dc.contributorUniversidade Federal de São Carlos (UFSCar)-
Autor(es): dc.contributorUniversidade Estadual Paulista (UNESP)-
Autor(es): dc.contributorFederal University of Rio Grande do Norte (UFRN)-
Autor(es): dc.contributorFederal University of Rondônia (UNIR)-
Autor(es): dc.contributorUniversidade Estadual de Maringá (UEM)-
Autor(es): dc.creatorSantos Junior, Antonio José-
Autor(es): dc.creatorHerradon, Marjorie Perosso-
Autor(es): dc.creatorde Souza, Matheus Viana-
Autor(es): dc.creatorda Silva, Sergio Augusto Mello-
Autor(es): dc.creatorDe Araujo, Victor Almeida-
Autor(es): dc.creatorde Almeida, Diego Henrique-
Autor(es): dc.creatordos Santos, Herisson Ferreira-
Autor(es): dc.creatorChristoforo, André Luis-
Data de aceite: dc.date.accessioned2025-08-21T23:35:49Z-
Data de disponibilização: dc.date.available2025-08-21T23:35:49Z-
Data de envio: dc.date.issued2025-04-29-
Data de envio: dc.date.issued2025-01-31-
Fonte completa do material: dc.identifierhttp://dx.doi.org/10.3390/f16020196-
Fonte completa do material: dc.identifierhttps://hdl.handle.net/11449/301942-
Fonte: dc.identifier.urihttp://educapes.capes.gov.br/handle/11449/301942-
Descrição: dc.descriptionGiven the construction challenges and the impacts of industrial waste generation and the implications of using chemical adhesives, this study aims to evaluate epoxy as an alternative resin, whose application in the production of wood particleboards is still underexplored. In this regard, its results were compared with those of widely used adhesives, such as urea-formaldehyde (UF). Pine wood particles were used, and epoxy resin was applied as a binder in 5%, 10%, and 15% proportions. Panels were manufactured under pressing parameters of 5 N/mm2 for 10 min at 110 °C. Physical and mechanical properties of panels were evaluated using Brazilian, European, and American standards. The results showed that epoxy resin is potentially convenient for the particleboard industry, as the 15% trait panels met the P4 class criteria in the Brazilian and European standards and D-2 for the American code, and the 10% trait panels achieved the M-3i class for the American document. Although 5% adhesive was insufficient to envelop wood particles, these traits with greater percentages reached high enveloping ratings in the scanning electron microscopy (SEM) test, making epoxy resin viable for the panel industry as a potential alternative to formaldehyde-based adhesives.-
Descrição: dc.descriptionDepartment of Civil Engineering Federal University of São Carlos (UFSCar), 235 km Washington Luis Highway, São Carlos-
Descrição: dc.descriptionDepartment of Civil Engineering São Paulo State University (UNESP) Ilha Solteira, 56 Brasil Sul Avenue-
Descrição: dc.descriptionDepartment of Architecture and Urbanism Federal University of Rio Grande do Norte (UFRN), Campus Universitário—Lagoa Nova-
Descrição: dc.descriptionDepartment of Civil Engineering Federal University of Rondônia (UNIR), 9.5 km BR 364 Highway, Porto Velho-
Descrição: dc.descriptionFederal Institute of Education Science and Technology of Rondônia (IFRO), RO-257 Highway, Ariquemes-
Descrição: dc.descriptionDepartment of Civil Engineering São Paulo State University (UNESP) Ilha Solteira, 56 Brasil Sul Avenue-
Idioma: dc.languageen-
Relação: dc.relationForests-
???dc.source???: dc.sourceScopus-
Palavras-chave: dc.subjectepoxy resin-
Palavras-chave: dc.subjectparticleboard-
Palavras-chave: dc.subjectpine-
Palavras-chave: dc.subjectwood panel-
Título: dc.titleEpoxy as an Alternative Resin in Particleboard Production with Pine Wood Residues: Physical, Mechanical, and Microscopical Analyses of Panels at Three Resin Proportions-
Tipo de arquivo: dc.typelivro digital-
Aparece nas coleções:Repositório Institucional - Unesp

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