Modeling the Stress Field in MSLA-Fabricated Photosensitive Resin Components: A Combined Experimental and Numerical Approach

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Autor(es): dc.contributorUniversidade Estadual Paulista (UNESP)-
Autor(es): dc.contributorUniversidad Cesar Vallejo-
Autor(es): dc.creatorOliveira, Geraldo Cesar Rosario de-
Autor(es): dc.creatorRosario de Oliveira, Vania Aparecida-
Autor(es): dc.creatorAlvarado Silva, Carlos Alexis-
Autor(es): dc.creatorGuidi, Erick Siqueira-
Autor(es): dc.creatorSilva, Fernando de Azevedo-
Data de aceite: dc.date.accessioned2025-08-21T15:19:20Z-
Data de disponibilização: dc.date.available2025-08-21T15:19:20Z-
Data de envio: dc.date.issued2025-04-29-
Data de envio: dc.date.issued2025-03-01-
Fonte completa do material: dc.identifierhttp://dx.doi.org/10.3390/modelling6010003-
Fonte completa do material: dc.identifierhttps://hdl.handle.net/11449/297488-
Fonte: dc.identifier.urihttp://educapes.capes.gov.br/handle/11449/297488-
Descrição: dc.descriptionThis study presents an experimental and numerical investigation into the stress field in cylinders manufactured from photosensitive resin using the Masked Stereolithography (MSLA) technique. For material characterization, tensile and bending test data from resin specimens were utilized. The stress field in resin disks was experimentally analyzed using photoelasticity and Digital Image Correlation (DIC) methods, subjected to compressive loads, according to the cylinder–plane contact model. Images were captured during the experiments using polarizing film and a low-cost CPL lens, coupled to a smartphone. The experimental results were compared with numerical and analytical simulations, where the formation of fringes and regions indicating the direction and magnitude of normal and shear stresses were observed, with variations ranging from 0.6% to 8.2%. The convergence of the results demonstrates the feasibility of using parts produced with commercially available photosensitive resin on non-professional printers for studying contact theory and stress fields. In the future, this methodology is intended to be applied to studies on stress in gears.-
Descrição: dc.descriptionFaculdade de Engenharia e Ciências Universidade Estadual Paulista “Júlio de Mesquita Filho”, Câmpus de Guaratinguetá, AvAriberto Pereira da Cunha, 333—Portal das Colinas, São Paulo-
Descrição: dc.descriptionResearch Group Digital Manufacturing and Educational Innovation Universidad Cesar Vallejo-
Descrição: dc.descriptionFaculdade de Engenharia e Ciências Universidade Estadual Paulista “Júlio de Mesquita Filho”, Câmpus de Guaratinguetá, AvAriberto Pereira da Cunha, 333—Portal das Colinas, São Paulo-
Idioma: dc.languageen-
Relação: dc.relationModelling-
???dc.source???: dc.sourceScopus-
Palavras-chave: dc.subjectDIC-
Palavras-chave: dc.subjectfinite element-
Palavras-chave: dc.subjectlow-cost mechanical tests-
Palavras-chave: dc.subjectMSLA-
Palavras-chave: dc.subjectphotoelasticity-
Palavras-chave: dc.subjectstrain-
Título: dc.titleModeling the Stress Field in MSLA-Fabricated Photosensitive Resin Components: A Combined Experimental and Numerical Approach-
Tipo de arquivo: dc.typelivro digital-
Aparece nas coleções:Repositório Institucional - Unesp

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