Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance

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MetadadosDescriçãoIdioma
Autor(es): dc.contributorUniversidade Estadual Paulista (UNESP)-
Autor(es): dc.contributorUniversidade Federal de Uberlândia (UFU)-
Autor(es): dc.contributorSchool of Integrated Studies-
Autor(es): dc.creatorFerreira, Fabio Isaac-
Autor(es): dc.creatorDe Aguiar, Paulo Roberto-
Autor(es): dc.creatorSilva, Rosemar Batista Da-
Autor(es): dc.creatorJackson, Mark James-
Autor(es): dc.creatorBaptista, Fabricio Guimaraes-
Autor(es): dc.creatorBianchi, Eduardo Carlos-
Data de aceite: dc.date.accessioned2025-08-21T19:44:18Z-
Data de disponibilização: dc.date.available2025-08-21T19:44:18Z-
Data de envio: dc.date.issued2023-03-02-
Data de envio: dc.date.issued2023-03-02-
Data de envio: dc.date.issued2022-06-15-
Fonte completa do material: dc.identifierhttp://dx.doi.org/10.1109/JSEN.2022.3172230-
Fonte completa do material: dc.identifierhttp://hdl.handle.net/11449/241790-
Fonte: dc.identifier.urihttp://educapes.capes.gov.br/handle/11449/241790-
Descrição: dc.descriptionOne of the most promising monitoring techniques is based on electromechanical impedance (EMI) transducers, which are low-cost components and allow easy implementation. EMI signal features showed good results for some applications in previous studies, but it is still unexplored for machining processes, which is essential for metal-cutting industries. This paper presents a new approach to verify the applicability of EMI measurements to monitor surface quality after the plunge cylindrical grinding of non-flat parts, which require low roughness and tight dimensional tolerances. Tests were carried out in a camshaft grinder and two low-cost piezoelectric diaphragms were attached to each workpiece to guarantee redundancy. Roughness R a was also monitored to check existence of correlation with the EMI signals and relevant discussions regarding monitoring by EMI are presented. Results showed a great correlation between EMI measurement and surface roughness: 0.94 and 0.80 for both diaphragms. Since these diaphragms cost less than 1 US dollar and good correlation was verified, this monitoring system is promising to replace the traditional ones.-
Descrição: dc.descriptionSão Paulo State University (UNESP) School of Engineering Electrical Engineering Department The Mechanical Engineering Department-
Descrição: dc.descriptionFederal University of Uberlândia Santa Mônica Campus School of Mechanical Engineering-
Descrição: dc.descriptionKansas State University School of Integrated Studies-
Descrição: dc.descriptionSão Paulo State University (UNESP) School of Engineering Electrical Engineering Department The Mechanical Engineering Department-
Formato: dc.format12314-12322-
Idioma: dc.languageen-
Relação: dc.relationIEEE Sensors Journal-
???dc.source???: dc.sourceScopus-
Palavras-chave: dc.subjectElectromechanical Impedance-
Palavras-chave: dc.subjectPiezoelectric transducers-
Palavras-chave: dc.subjectPlunge cylindrical grinding-
Palavras-chave: dc.subjectStructural health monitoring-
Palavras-chave: dc.subjectSurface roughness-
Título: dc.titleMonitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance-
Tipo de arquivo: dc.typelivro digital-
Aparece nas coleções:Repositório Institucional - Unesp

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