Effects of interfacial adhesion on thermal and mechanical properties

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MetadadosDescriçãoIdioma
Autor(es): dc.contributorUniversidade Estadual Paulista (UNESP)-
Autor(es): dc.creatorBrocks, T.-
Autor(es): dc.creatorCioffi, M. O.H.-
Autor(es): dc.creatorVoorwald, H. J.C.-
Data de aceite: dc.date.accessioned2025-08-21T18:38:17Z-
Data de disponibilização: dc.date.available2025-08-21T18:38:17Z-
Data de envio: dc.date.issued2022-04-29-
Data de envio: dc.date.issued2022-04-29-
Data de envio: dc.date.issued2012-01-01-
Fonte completa do material: dc.identifierhttp://hdl.handle.net/11449/227792-
Fonte: dc.identifier.urihttp://educapes.capes.gov.br/handle/11449/227792-
Descrição: dc.descriptionCarbon fiber/epoxy matrix composites produced by resin transfer molding (RTM) were investigated in order to define the influence of interfacial adhesion on mechanical and thermal properties. The adhesion was studied through DMA, DSC and TGA thermal analyses and tensile test. SEM analyses of fibers surface and tensile fractures support the conclusion that the composite with higher degradation temperature and Tg value has better interface boundary. Besides, the DMA results corroborate with the same conclusion.-
Descrição: dc.descriptionFatigue and Aeronautical Research Group, Materials and Technology, Univ. Estadual Paulista, Ariberto Pereira da Cunha Ave., 333, Guaratinguetá - SP-
Descrição: dc.descriptionFatigue and Aeronautical Research Group, Materials and Technology, Univ. Estadual Paulista, Ariberto Pereira da Cunha Ave., 333, Guaratinguetá - SP-
Idioma: dc.languageen-
Relação: dc.relationECCM 2012 - Composites at Venice, Proceedings of the 15th European Conference on Composite Materials-
???dc.source???: dc.sourceScopus-
Palavras-chave: dc.subjectDMA-
Palavras-chave: dc.subjectInterfacial adhesion-
Palavras-chave: dc.subjectPolymeric matrix-
Palavras-chave: dc.subjectRTM-
Título: dc.titleEffects of interfacial adhesion on thermal and mechanical properties-
Tipo de arquivo: dc.typeaula digital-
Aparece nas coleções:Repositório Institucional - Unesp

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