Development of a micro-heat exchanger with stacked plates using LTCC technology

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Autor(es): dc.contributorUniversidade de São Paulo (USP)-
Autor(es): dc.contributorUniversidade Estadual Paulista (UNESP)-
Autor(es): dc.contributorCTPP-
Autor(es): dc.creatorVásquez-Alvarez, E.-
Autor(es): dc.creatorDegasperi, F. T. [UNESP]-
Autor(es): dc.creatorMorita, L. G.-
Autor(es): dc.creatorGongora-Rubio, M. R.-
Autor(es): dc.creatorGiudici, R.-
Data de aceite: dc.date.accessioned2022-08-04T22:02:15Z-
Data de disponibilização: dc.date.available2022-08-04T22:02:15Z-
Data de envio: dc.date.issued2022-04-28-
Data de envio: dc.date.issued2022-04-28-
Data de envio: dc.date.issued2010-01-01-
Fonte completa do material: dc.identifierhttp://dx.doi.org/10.1590/S0104-66322010000300012-
Fonte completa do material: dc.identifierhttp://hdl.handle.net/11449/219613-
Fonte: dc.identifier.urihttp://educapes.capes.gov.br/handle/11449/219613-
Descrição: dc.descriptionA green ceramic tape micro-heat exchanger was developed using Low Temperature Co-fired Ceramics technology (LTCC). The device was designed by using Computational Aided Design software and simulations were made using a Computational Fluid Dynamics package (COMSOL Multiphysics) to evaluate the homogeneity of fluid distribution in the microchannels. Four geometries were proposed and simulated in two and three dimensions to show that geometric details directly affect the distribution of velocity in the micro-heat exchanger channels. The simulation results were quite useful for the design of the microfluidic device. The micro-heat exchanger was then constructed using the LTCC technology and is composed of five thermal exchange plates in cross-flow arrangement and two connecting plates, with all plates stacked to form a device with external dimensions of 26 x 26 x 6 mm3.-
Descrição: dc.descriptionUniversidade de São Paulo Escola Politécnica Department of Chemical Engineering, Av. Prof. Luciano Gualberto 380, Trav. 3, CEP: 05508-900, São Paulo - SP-
Descrição: dc.descriptionFaculdade de Tecnologia de São Paulo FATEC-SP CEETEPS UNESP, São Paulo - SP-
Descrição: dc.descriptionInstituto de Pesquisas Tecnológicas CTPP, Rua Prof. Almeida Prado 532, CEP: 05508-901, São Paulo - SP-
Descrição: dc.descriptionFaculdade de Tecnologia de São Paulo FATEC-SP CEETEPS UNESP, São Paulo - SP-
Formato: dc.format483-497-
Idioma: dc.languageen-
Relação: dc.relationBrazilian Journal of Chemical Engineering-
???dc.source???: dc.sourceScopus-
Palavras-chave: dc.subjectCFD-
Palavras-chave: dc.subjectLTCC-
Palavras-chave: dc.subjectMicrostructured heat exchanger-
Título: dc.titleDevelopment of a micro-heat exchanger with stacked plates using LTCC technology-
Tipo de arquivo: dc.typelivro digital-
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