Electromechanical impedance (EMI) measurements to infer features from the grinding process

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MetadadosDescriçãoIdioma
Autor(es): dc.contributorUniversidade Estadual Paulista (Unesp)-
Autor(es): dc.contributorUniversidade Federal de Uberlândia (UFU)-
Autor(es): dc.contributorKansas State University Polytechnic Campus-
Autor(es): dc.creatorFerreira, Fabio Isaac [UNESP]-
Autor(es): dc.creatorde Aguiar, Paulo Roberto [UNESP]-
Autor(es): dc.creatorda Silva, Rosemar Batista-
Autor(es): dc.creatorJackson, Mark James-
Autor(es): dc.creatorde Souza Ruzzi, Rodrigo-
Autor(es): dc.creatorBaptista, Fabrício Guimarães [UNESP]-
Autor(es): dc.creatorBianchi, Eduardo Carlos [UNESP]-
Data de aceite: dc.date.accessioned2022-02-22T00:33:29Z-
Data de disponibilização: dc.date.available2022-02-22T00:33:29Z-
Data de envio: dc.date.issued2020-12-11-
Data de envio: dc.date.issued2020-12-11-
Data de envio: dc.date.issued2019-12-31-
Fonte completa do material: dc.identifierhttp://dx.doi.org/10.1007/s00170-019-04733-8-
Fonte completa do material: dc.identifierhttp://hdl.handle.net/11449/201419-
Fonte: dc.identifier.urihttp://educapes.capes.gov.br/handle/11449/201419-
Descrição: dc.descriptionThis paper discusses the correlations between the electromechanical impedance (EMI) technique and grinding parameters. The EMI technique applied in grinding is novel and has the advantage of employing cheaper equipment and requiring a simpler monitoring system when compared to traditional techniques, such as acoustic emission. Experimental tests were conducted in a controlled environment to isolate the variables of interest, and real and imaginary parts of the impedance were investigated for several frequency bands. Strong correlations among EMI and equivalent chip thickness, roughness, and microhardness of the workpiece, as well as power signals, were found. The RMSD (root-mean-square deviation) index for the real part of the signature in the band 80–85 kHz showed good correlation with roughness and power, while the CCDM (correlation coefficient deviation metric) index for the imaginary part of 50–55 kHz showed good correlation with microhardness. Those correlations allow the user to infer information about the grinding process through indirect monitoring.-
Descrição: dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)-
Descrição: dc.descriptionCoordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)-
Descrição: dc.descriptionDepartment of Electrical Engineering Sao Paulo State University (UNESP), Av. Eng. Luís Edmundo Carrijo Coube, 14-01 – CEP-
Descrição: dc.descriptionSchool of Mechanical Engineering Federal University of Uberlândia (UFU), Av. João Naves de Ávila, 2121-
Descrição: dc.descriptionSchool of Integrated Studies Kansas State University Polytechnic Campus, 2310 Centennial Rd-
Descrição: dc.descriptionDepartment of Mechanical Engineering Sao Paulo State University (UNESP), Av. Eng. Luís Edmundo Carrijo Coube, 14-01-
Descrição: dc.descriptionDepartment of Electrical Engineering Sao Paulo State University (UNESP), Av. Eng. Luís Edmundo Carrijo Coube, 14-01 – CEP-
Descrição: dc.descriptionDepartment of Mechanical Engineering Sao Paulo State University (UNESP), Av. Eng. Luís Edmundo Carrijo Coube, 14-01-
Descrição: dc.descriptionCNPq: 426018/2018-4-
Descrição: dc.descriptionCAPES: PDSE 88881.190384/2018-01-
Formato: dc.format2035-2048-
Idioma: dc.languageen-
Relação: dc.relationInternational Journal of Advanced Manufacturing Technology-
???dc.source???: dc.sourceScopus-
Palavras-chave: dc.subjectElectromechanical impedance-
Palavras-chave: dc.subjectGrinding-
Palavras-chave: dc.subjectPiezoelectric transducer-
Palavras-chave: dc.subjectStructural health monitoring-
Palavras-chave: dc.subjectSurface quality-
Título: dc.titleElectromechanical impedance (EMI) measurements to infer features from the grinding process-
Tipo de arquivo: dc.typelivro digital-
Aparece nas coleções:Repositório Institucional - Unesp

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