Effect of tartrate content on aging and deposition condition of copper-tin electrodeposits from a non-cyanide acid bath

Registro completo de metadados
MetadadosDescriçãoIdioma
Autor(es): dc.contributorUniversidade Estadual Paulista (UNESP)-
Autor(es): dc.creatorCarlos, I. A.-
Autor(es): dc.creatorBidoia, E. D.-
Autor(es): dc.creatorPallone, EMJA-
Autor(es): dc.creatorAlmeida, MRH-
Autor(es): dc.creatorSouza, CAC-
Data de aceite: dc.date.accessioned2021-03-10T17:15:44Z-
Data de disponibilização: dc.date.available2021-03-10T17:15:44Z-
Data de envio: dc.date.issued2014-05-20-
Data de envio: dc.date.issued2014-05-20-
Data de envio: dc.date.issued2002-08-01-
Fonte completa do material: dc.identifierhttp://dx.doi.org/10.1016/S0257-8972(02)00139-1-
Fonte completa do material: dc.identifierhttp://hdl.handle.net/11449/20067-
Fonte: dc.identifier.urihttp://educapes.capes.gov.br/handle/11449/20067-
Descrição: dc.descriptionThe effect of the presence of tartrate additive on the chemical stability of a Cu-Sn acid bath was evaluated. It was observed that this additive hinders decomposition of the Cu/Sn deposition bath with storage time, since the decrease in electrochemical efficiency was attenuated. In addition, it was observed that optimal galvanostatic deposition with or without tartrate occurs at approximately 11 mA cm(-2). However, in the presence of tartrate the deposition charge was lower, leading to lower energy consumption. SEM analysis showed that the tartrate added to the plating bath caused a marked change in the morphology of the Cu/Sn films obtained gal vanostatic ally. (C) 2002 Elsevier B.V. B.V. All rights reserved.-
Formato: dc.format14-18-
Idioma: dc.languageen-
Publicador: dc.publisherElsevier B.V.-
Relação: dc.relationSurface & Coatings Technology-
Relação: dc.relation2.906-
Relação: dc.relation0,928-
Direitos: dc.rightsclosedAccess-
Palavras-chave: dc.subjectelectroplating-
Palavras-chave: dc.subjectcopper-tin alloy-
Palavras-chave: dc.subjecttartrate-
Título: dc.titleEffect of tartrate content on aging and deposition condition of copper-tin electrodeposits from a non-cyanide acid bath-
Tipo de arquivo: dc.typelivro digital-
Aparece nas coleções:Repositório Institucional - Unesp

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